SMT/HYBRID/PACKAGING 2005 call for tutorials

A call for tutorials has been issued by the organisers of the SMT/HYBRID/PACKAGING 2005 show (19-21st April 2005). The organisers are particularly keen to receive abstracts about lead-free assembly or automotive applications, but also list a wide range of other topics for submissions:

– Vertical system integration on PCBs

– Packaging of electronic components

– Electronic assembly design

– Assembly of electronic components

– Electronic assembly interconnection technologies

– Electronic assembly process technologies

– Electronic assembly diagnostics and quality assurance

– Technical reliability of electronic assembly

– Advanced materials

– Sustainability

The deadline for submissions is 8th October 2004.