The organisers of SMT/HYBRID/PACKAGING 2006, which will run from 30th May to 1st June 2006, have issued a call for tutorials. Tutorials are being sought – up to the deadline of 17th October – in a number of areas including vertical system integration on PCBs, packaging of electronic components / PCB interface, advanced materials and sustainability. The main focus of the 2006 conference will be a full-day session on “Technologies for the third dimension (heterointegration) in the PCB fabrication”.